Lerninhalte |
Im Modul werden Kenntnisse über technologische Verfahren zur Herstellung von mikroelektronischen und mikromechanischen Elementen und Systemen vermittelt. Inhalte 1. Wafer Processing : (a) Basics of Vacuumtechnique (b) Coating (Physical Vapour Deposition PVD, Chemical Vapour Deposition CVD, Oxidation) (c) Pattern Formation (d) Etching Technology (Isotropic & Anisotropic Etching, Barrel, IE, RIE, RIBE, IBE) (e) Lift-Off-Process (f) Nano-Structure Formation by Anisotriopic Etching (g) LIGA-Technique (h) Doping (Diffusion, Implantation) (i) Thermal Processes (Thermal Annealing, Formation of Contacts) (j) Application of Deposition, Etching and Thermal Processes in Schottky-Technology (k) Metal Layers - Conductor Run (l) High Precision Resistances (m) Passivation 2. Assembly Technology : (a) Substrate Materials (b) Metallization of Wafer Backside (c) Integration of Semiconductor Chips (Chip & Wire Bonding, Beam-Lead, Flip-Chip) |