Coatings are usually used to protect printed circuit boards (PCB) from harsh environment. It is difficult to cure thick coatings from exterior to interior as the heat curing. In this case, curing by the means of microwave irradiation can be taken into account. With the participation of metallic structures, there will be some challenges such as inhomogeneous field distributions or high risk of high field strengths. So with the help of numerical simulations, this study is carried out for finding how PCB structures react with the microwave radiation to support homogeneous coating cures.
