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Lifetime modelling of large area solder joints in power electronic inverter units  (  Dissertationsschrift  ) 
Power electronics (PE) modules in inverter units are a critical part of the Hybrid/Electric vehicles drivetrain. During passive temperature cycling, the solder joint between the PE module and the baseplate develops cracks. A detailed reliability investigation was carried out on multiple physical variants under three temperature cycling profiles to uncover major influence parameters. A stress triaxiality and inelastic strain based FEM damage parameter was formulated which showed excellent correlation with experimental results.<eng>
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